Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
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20 results for Dave Hetzer
Material and process improvements towards sub 36nm pitch EUV single exposure
- Karen Petrillo
- Dave Hetzer
- et al.
- 2019
- ANTS 2019
Electrical validation of the integration of 193i and DSA for sub-20nm metal cut patterning
- Chi Chun Liu
- Richard Farrell
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
The defect mitigation on EUV stack by track based technology
- Naoki Shibata
- Lior Huli
- et al.
- 2019
- SPIE Advanced Lithography 2019
Track based techniques to improve high-resolution EUV patterning defectivity
- Naoki Shibata
- Lior Huli
- et al.
- 2018
- EUVL 2018
Defect detection strategies and process partitioning for SE EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2018
- SPIE Advanced Lithography 2018
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- Chi-Chun Liu
- Yann Mignot
- et al.
- 2018
- SPIE Advanced Lithography 2018
Coater/developer based techniques to improve high-resolution EUV patterning defectivity
- Koichi Hontake
- Lior Huli
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017