Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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43 results for Robert Polastre

Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- - Bing Dang
  - Evan Colgan
  - et al.
- 2016
- ECTC 2016
Advanced wafer bonding and laser debonding
- - Paul Andry
  - Russell A. Budd
  - et al.
- 2014
- ECTC 2014
Transferrable fine pitch probe technology
- - Y. Liu
  - S.L. Wright
  - et al.
- 2014
- ECTC 2014
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- - Steven L. Wright
  - Cornelia Tsang
  - et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- - John Knickerbocker
  - Paul Andry
  - et al.
- 2012
- ECTC 2012
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- - Steven L. Wright
  - Paul S. Andry
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008