Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
Publications
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61 results for Robert Rosenberg
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
Low-k BEOL mechanical modeling
- Xiao Hu Liu
- Michael W. Lane
- et al.
- 2004
- ADMETA 2004
Channel cracking in low-k films on patterned multi-layers
- X.-H. Liu
- T.M. Shaw
- et al.
- 2004
- IITC 2004
Reliability challenges with ultra-low k interlevel dielectrics
- J.R. Lloyd
- M. Lane
- et al.
- 2004
- Microelectronics Reliability
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004