Son Van Nguyen, Hosadurga Shobha, et al.
VLSI-TSA 2020
It has been demonstrated that, in those instances where electromigration-induced mass transport is dominated by interfacial diffusion, the adhesion at the interface where mass transport is primarily taking place is related to the electromigration flux. Furthermore, it is shown that the cohesive energy of the interface is directly related to the activation energy for diffusion. © 2005 IEEE.
Son Van Nguyen, Hosadurga Shobha, et al.
VLSI-TSA 2020
James J. Kelly, Takeshi Nogami, et al.
ECS Meeting 2011
Joanna Atkin, T.M. Shaw, et al.
IRPS 2012
George Y. Onoda, Eric G. Liniger
Physical Review A