Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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61 results for Robert Rosenberg

VALUE D₀Z* for GRAIN BOUNDARY ELECTROMIGRATION in ALUMINUM FILMS
- - R. Rosenberg
- 2003
- Applied Physics Letters
Resistivity of rf sputter-thinned aluminum films
- - A.F. Mayadas
  - R.T.C. Tsui
  - et al.
- 2003
- Applied Physics Letters
Resistance monitoring and effects of nonadhesion during electromigration in aluminum films
- - R. Rosenberg
  - L. Berenbaum
- 2003
- Applied Physics Letters
Growth of uniaxial magnetic garnet films by rf sputtering
- - J.J. Cuomo
  - V. Sadagopan
  - et al.
- 2003
- Applied Physics Letters
Liner materials for direct electrodeposition of Cu
- - M.W. Lane
  - C.E. Murray
  - et al.
- 2003
- Applied Physics Letters
Reduced electromigration of Cu wires by surface coating
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2002
- Applied Physics Letters
Electromigration in on-chip single/dual damascene Cu interconnections
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2002
- JES
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- - R. Filippi
  - R.A. Wachnik
  - et al.
- 2002
- Journal of Applied Physics
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2001
- Applied Physics Letters
Copper metallization for high performance silicon technology
- - R. Rosenberg
  - D. Edelstein
  - et al.
- 2000
- Annual Review of Materials Science