Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
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61 results for Robert Rosenberg
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
Bimodal electromigration mechanisms in dual-damascene Cu line/via on W
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- IITC 2002
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
Scaling effect on electromigration in on-chip Cu wiring
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- IITC 1999
Electromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
The microstructural stability of Al(Cu) lines during electromigration
- T.M. Shaw
- C.-K. Hu
- et al.
- 1995
- Applied Physics Letters