Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
- Jae-Woong Nah
- J.O. Suh
- et al.
- 2006
- Journal of Applied Physics
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230 results for King-Ning Tu
Transmission electron microscopy of the formation of nickel silicides
- H. Föll
- P.S. Ho
- et al.
- 2006
- Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
- Albert T. Wu
- K.N. Tu
- et al.
- 2004
- Applied Physics Letters
Preparation and structure of Fe-doped EuO films
- K.Y. Ahn
- K.N. Tu
- et al.
- 2003
- Journal of Applied Physics
X-ray topographic determination of the absence of lateral strains in ion-implanted silicon
- K.N. Tu
- P. Chaudhari
- et al.
- 2003
- Journal of Applied Physics
X-ray study of interdiffusion in bimetallic CuSingle Bond signAu films
- K.N. Tu
- B.S. Berry
- 2003
- Journal of Applied Physics
Mass transport along grain boundaries of silver
- K.N. Tu
- 2003
- Journal of Applied Physics
Circular etch pits in ion-implanted amorphous silicon films
- K.N. Tu
- S.I. Tan
- et al.
- 2003
- Applied Physics Letters
Analysis of formation of hafnium silicide on silicon
- C.J. Kircher
- J.W. Mayer
- et al.
- 2003
- Applied Physics Letters
Formation of vanadium silicides by the interactions of v with bare and oxidized Si wafers
- K.N. Tu
- J.F. Ziegler
- et al.
- 2003
- Applied Physics Letters