Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
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23 results for Kazushige Toriyama
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- Kuniaki Sueoka
- Akihiro Horibe
- et al.
- 2015
- 3DIC 2015
Warpage analysis of organic substrates for 2.1D packaging
- Sayuri Kohara
- Keishi Okamoto
- et al.
- 2015
- 3DIC 2015
Through silicon via process for effective multi-wafer integration
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2015
- ECTC 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- Hiroyuki Mori
- Sayuri Kohara
- et al.
- 2015
- InterPACK 2015
Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- Keishi Okamoto
- Sayuri Kohara
- et al.
- 2015
- ICEP-IAAC 2015
Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
IMS (injection molded solder) technology with liquid photoresist for ultra fine pitch bumping
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- IMAPS 2014
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Characterization of micro bump formed by Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- ICEP 2014