Development and commercialization of solder bump fabrication technology with molten solder injection method
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2015
- J. Jpn. Inst. Electron. Packag.
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23 results for Kazushige Toriyama
Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia
High-bandwidth density and low-power optical MCM using waveguide-integrated organic substrate
- Masao Tokunari
- Hsiang-Han Hsu
- et al.
- 2014
- Journal of Lightwave Technology