Oxidation study of pure tin and its alloys via electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2004
- Symposium on “Challenges in Advanced Thin Films: Microstructures, Interfaces, and Reactions" 2004
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67 results for Sung K. Kang
Isothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity
- B.A. Cook
- I.E. Anderson
- et al.
- 2003
- Journal of Electronic Materials
Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials
New high conductivity lead (Pb)-free conducting adhesives
- S.K. Kang
- T. Graham
- et al.
- 1995
- IEEE International Symposium on Electronics and the Environment 1995
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
Development of lead (Pb)-free interconnection materials for microelectronics
- Sung K. Kang
- 1999
- Metals and Materials International
Development of conducting adhesive materials for microelectronic applications
- Sung K. Kang
- S. Purushothaman
- 1999
- Journal of Electronic Materials
Study of interfacial reactions between tin and copper by differential scanning calorimetry
- S.K. Kang
- S. Purushothaman
- 1998
- Journal of Electronic Materials
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
- Jaewon Chang
- Sung K. Kang
- et al.
- 2015
- Journal of Electronic Materials
Effects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition
- Myung-Won Jung
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials