Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
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67 results for Sung K. Kang
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Characterization of electroplated bismuth-tin alloys for electrically conducting materials
- S.K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Journal of Electronic Materials
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Development of lead (Pb)-free interconnection materials for microelectronics
- Sung K. Kang
- 1999
- Metals and Materials International
Development of conducting adhesive materials for microelectronic applications
- Sung K. Kang
- S. Purushothaman
- 1999
- Journal of Electronic Materials
Development of low cost, low temperature conductive adhesives
- S.K. Kang
- S. Purushothaman
- 1998
- ECTC 1998
Development of high conductivity lead (Pb)-free conducting adhesives
- Sung K. Kang
- Rajinder S. Rai
- et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Study of interfacial reactions between tin and copper by differential scanning calorimetry
- S.K. Kang
- S. Purushothaman
- 1998
- Journal of Electronic Materials