Characterization of electroplated bismuth-tin alloys for electrically conducting materials
- S.K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Journal of Electronic Materials
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67 results for Sung K. Kang
Development of high conductivity lead (Pb)-free conducting adhesives
- Sung K. Kang
- Rajinder S. Rai
- et al.
- 1998
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Future packaging materials: Cost performance, and environmental issues
- J.M. Shaw
- Stephen L. Buchwalter
- et al.
- 1996
- American Chemical Society, Polymer Preprints, Division of Polymer Chemistry
Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders
- S.K. Kang
- R.S. Rai
- et al.
- 1996
- Journal of Electronic Materials
Lead (Pb)-free solders for electronic packaging
- Sung K. Kang
- Amit K. Sarkhel
- 1994
- Journal of Electronic Materials
Nickel-alloyed tin-lead eutectic solder for surface mount technology
- Sung K. Kang
- Thomas G. Ference
- 1993
- Journal of Materials Research
Creep-fatigue interaction in eutectic lead-tin solder alloy
- R.C. Weinbel
- J.K. Tien
- et al.
- 1987
- Journal of Materials Science