Moisture-induced interfacial oxidation of chromium on polyimide
B.K. Furman, H.M. Clearfield, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
The interfacial reactions of Cu and Ni base metals with several lead-free solders are investigated at their corresponding reflow temperatures. The solid-liquid reaction which occurs during the initial solder joint formation and rework process is simulated by the studied interfacial reactions. The Pb-free solders used in the investigation include: Bi/Sn, Sn/Ag, Sn/Sb and Sn. The Sn/Pb eutectic solder is also included as a benchmark to compare the reaction kinetics with those of the Pb-free solders. The dissolution kinetics of Cu and Ni into the Pb-free solders as well as the growth kinetics of the intermetallic phases are measured using cross-sectional metallography of reaction couples and are compared with those obtained from the Sn/Pb eutectic solder.
B.K. Furman, H.M. Clearfield, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A.C. Callegan, K. Babich, et al.
Microelectronic Engineering
S.K. Kang, T. Graham, et al.
IEEE International Symposium on Electronics and the Environment 1995
S. Purushothaman, T. Caulfield
Journal of Applied Physics