Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders
- Sung K. Kang
- Jaewon Chang
- et al.
- 2013
- ECTC 2013
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13 results for Hyuck Mo Lee
Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
- Jaewon Chang
- Sung K. Kang
- et al.
- 2015
- Journal of Electronic Materials
Investigation of Sn whisker growth in electroplated Sn and Sn-Ag as a function of plating variables and storage conditions
- Jaewon Chang
- Sung K. Kang
- et al.
- 2013
- Journal of Electronic Materials
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2011
- Journal of Materials Research
Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2010
- JOM
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Microelectronics Reliability