Analytical extraction of via near-field coupling using a multiple scattering approach
- Sebastian Muller
- Andreas Hardock
- et al.
- 2013
- SPI 2013
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8 results for Heinz-Dietrich Brüns
Impact of multiple scattering on passivity of equivalent-circuit via models
- Xiaomin Duan
- Renato Rimolo-Donadio
- et al.
- 2011
- EDAPS 2011
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- Sebastian Müller
- Torsten Reuschel
- et al.
- 2015
- IEEE Trans Electromagn Compat
Using via stubs in periodic structures for microwave filter design
- Andreas Hardock
- Young H. Kwark
- et al.
- 2014
- IEEE Transactions on CPMT
Application of vias as functional elements in microwave coupling structures
- Andreas Hardock
- Renato Rimolo-Donadio
- et al.
- 2013
- IEEE T-MTT
Complete modeling of large via constellations in multilayer printed circuit boards
- Sebastian Müller
- Fabian Happ
- et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
- Renato Rimolo-Donadio
- Xiaoxiong Gu
- et al.
- 2009
- IEEE T-MTT