Nicolas Dupuis, Benjamin G. Lee, et al.
Journal of Lightwave Technology
This paper presents a novel form of microwave filter construction using vias (plated through holes) available in generic printed circuit boards as the main building block. It is demonstrated that for a certain arrangement of vias, the resonant behavior of via stubs can be used to create a low- or a high-pass filter using open- or short-circuited vias, respectively. These stubs are periodically cascaded, resembling an analogous implementation using transmission-line stub filters. It will be shown that such a via filter structure can achieve insertion loss lower than 0.1 dB and return loss of about ?60 dB in the passband at GHz frequencies. Measurements, full-wave, and physics-based simulations are presented to verify this novel filter concept and to provide design guidelines in the frequency range from 1 to 20 GHz. © 2014 IEEE.
Nicolas Dupuis, Benjamin G. Lee, et al.
Journal of Lightwave Technology
Lei Shan, Young Kwark, et al.
ECTC 2014
Ki Jin Han, Xiaoxiong Gu, et al.
IEEE Transactions on CPMT
Chirag S. Patel, Cornelia K. Tsang, et al.
ECTC 2005