An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
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14 results for Jun Fan
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
Inductance calculations for plane-pair area fills with vias in a power distribution network using a cavity model and partial inductances
- Jingook Kim
- Jun Fan
- et al.
- 2011
- IEEE T-MTT
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
- Renato Rimolo-Donadio
- Xiaoxiong Gu
- et al.
- 2009
- IEEE T-MTT