Tungsten oxide nanowire growth by chemically induced strain
- Christian Klinke
- James B. Hannon
- et al.
- 2005
- Journal of Physical Chemistry B
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144 results for Lynne Gignac
Imaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscope
- L. Gignac
- M. Kawasaki
- et al.
- 2005
- Journal of Applied Physics
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
Top-down topography of deeply etched silicon in the scanning electron microscope
- Oliver C. Wells
- Conal E. Murray
- et al.
- 2004
- Review of Scientific Instruments
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
- R.F. Liu
- C.-K. Hu
- et al.
- 2004
- Journal of Applied Physics
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Growth of crystalline defects on the surface of FSG dielectrics
- J.P. Gambino
- J. Burnham
- et al.
- 2003
- AMC 2003