Conference paper
A multilevel copper/low-k/airgap BEOL technology
S.V. Nitta, S. Ponoth, et al.
ADMETA 2007
The electromigration lifetime of a dual-damascene Cu line, where a W lower level line was connected to it, was investigated. The samples were tested using different failure criteria which was based on increase in test line resistance. It was observed that the lifetime distribution with failure criteria of 1% resistance increase was trimodal, while it was bimodal for a failure criteria of 50%. The three different types of observed deviant line resistance behaviors included plateau, fluctuation and uphill.
S.V. Nitta, S. Ponoth, et al.
ADMETA 2007
C.-K. Hu, L. Gignac, et al.
ECS Meeting 2006
C.-K. Hu, K.P. Rodbell, et al.
IBM J. Res. Dev
G. Wang, H. Zhang, et al.
MRS Spring Meeting 2006