Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
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140 results for Lynne Gignac
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
High coercivity of ultra-high-density ordered Co nanorod arrays
- T. Shibauchi
- L. Krusin-Elbaum
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
Dynamics of one-dimensional domain walls interacting with disorder potential
- L. Krusin-Elbaum
- T. Shibauchi
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Linewidth and underlayer influence on texture in submicrometer-wide Al and AlCu lines
- J.L. Hurd
- K.P. Rodbell
- et al.
- 1998
- Applied Physics Letters
Electromigration in 0.25 μm wide Cu line on W
- C.-K. Hu
- K.Y. Lee
- et al.
- 1997
- Thin Solid Films
The stability of Si1-xGex strained layers on small-area trench-isolated silicon
- K. Schonenberg
- Siu-Wai Chan
- et al.
- 1997
- Journal of Materials Research
Porous SiO2 films analyzed by transmission electron microscopy
- L. Gignac
- T.M. Parrill
- et al.
- 1995
- Thin Solid Films