C. Lavoie, C. Cabral Jr., et al.
MRS Fall Meeting 1995
During a transient period following deposition, the microstructure of electroplated copper thin films evolve towards larger grain size, different preferred crystallographic texture, and less resistivity, hardness and compressive stress. A model to account for this observation is derived based on grain boundary energy in the fine-grained as-deposited films providing the underlying energy density driving abnormal grain growth. Model predictions describe the mechanisms for the evolution process.
C. Lavoie, C. Cabral Jr., et al.
MRS Fall Meeting 1995
L. Gignac, V. Svilan, et al.
MRS Fall Meeting 1996
J.M.E. Harper
Emergent Process Methods for High-Technology Ceramics 1983
J.M.E. Harper, C. Cabral Jr., et al.
MRS Spring Meeting 1999