Electromigration challenges for nanoscale Cu wiring
- C.-K. Hu
- L. Gignac
- et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
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144 results for Lynne Gignac
Material and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Precision, double XTEM sample preparation of site specific Si nanowires
- L. Gignac
- S. Mittal
- et al.
- 2009
- Microscopy and Microanalysis
Three-dimensional measurement of line edge roughness in copper wires using electron tomography
- Peter Ercius
- Lynne M. Gignac
- et al.
- 2009
- Microscopy and Microanalysis
Hydrazine-based deposition route for device-quality CIGS films
- David B. Mitzi
- Min Yuan
- et al.
- 2009
- Thin Solid Films
Measurements of carrier transport in MOSFETs with bottom-up nanowire channel as a function of the nanowire diameter
- G.M. Cohen
- S. Bangsaruntip
- et al.
- 2008
- DRC 2008
Electromigration reliability in nanoscale Cu interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- MRS Fall Meeting 2007
The effect of microstructure on resistivity and reliability in copper interconnects
- Lynne M. Gignac
- C.-K. Hu
- et al.
- 2007
- AMC 2007
Channel Strain Characterization in Embedded SiGe by Nano-beam Diffraction
- J. Li
- A. Lamberti
- et al.
- 2008
- ECS Meeting 2008
Extendibility of NiPt silicide to the 22-nm node CMOS technology
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2008
- IWJT 2008