Conference paperDamascene copper integration impact on electomigration and stress migrationAnthony K. Stamper, H. Baks, et al.AMC 2005
PaperComparison of Cu electromigration lifetime in Cu interconnects coated with various capsC.-K. Hu, L. Gignac, et al.Applied Physics Letters
PaperElectromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etchingR. Filippi, M. Gribelyuk, et al.Thin Solid Films
Conference paperElectromigration reliability in nanoscale Cu interconnectsC.-K. Hu, L. Gignac, et al.MRS Fall Meeting 2007