Light assisted electrodeposition and silicidation of Ni for silicon photovoltaic cell metallization
- Qiang Huang
- Satyavolu S. Papa Rao
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
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13 results for Satyavolu S. Papa Rao
Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
- Jingwei Bai
- Deqiang Wang
- et al.
- 2014
- Nanoscale
Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
- Lei Meng
- Satyavolu S. Papa Rao
- et al.
- 2013
- IEEE Journal of Photovoltaics
Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
- Lei Meng
- Satyavolu S. Papa Rao
- et al.
- 2012
- PVSC 2012
Effects of chemical mechanical polishing on a porous SiCOH dielectric
- S. Gates
- S. Papa Rao
- et al.
- 2012
- Microelectronic Engineering
Thermal stability of copper contact metallization using Ru-containing liner
- Soon-Cheon Seo
- C.-C. Yang
- et al.
- 2011
- Electrochemical and Solid-State Letters
Development and characterization of advanced process technologies for the fabrication of crystalline-Si solar cells
- Satyavolu S. Papa Rao
- Kate Fisher
- et al.
- 2010
- PVSC 2010
Reducing time dependent line to line leakage following post CMP clean
- Donald F. Canaperi
- Satyavolu S. Papa Rao
- et al.
- 2010
- MRS Online Proceedings Library
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008