Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
- Lei Meng
- Satyavolu S. Papa Rao
- et al.
- 2012
- PVSC 2012
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13 results for Satyavolu S. Papa Rao
Development and characterization of advanced process technologies for the fabrication of crystalline-Si solar cells
- Satyavolu S. Papa Rao
- Kate Fisher
- et al.
- 2010
- PVSC 2010
Reducing time dependent line to line leakage following post CMP clean
- Donald F. Canaperi
- Satyavolu S. Papa Rao
- et al.
- 2010
- MRS Online Proceedings Library
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
The effect of material and process interactions on BEOL integration
- T. Spooner
- J.C. Arnold
- et al.
- 2009
- ECS Meeting 2009
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
A comparative study of ceria-based and silica-based slurries for 32 nm shallow trench isolation chemical mechanical planarization
- Jason E. Cummings
- Matthew D. Smalley
- et al.
- 2008
- CMP-MIC 2008
Light assisted electrodeposition and silicidation of Ni for silicon photovoltaic cell metallization
- Qiang Huang
- Satyavolu S. Papa Rao
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
- Jingwei Bai
- Deqiang Wang
- et al.
- 2014
- Nanoscale