Electromigration reliability in nanoscale Cu interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- MRS Fall Meeting 2007
Publications
Date
Featured collections
Popular topics
14 results for Brett C. Baker-O'Neal
The effect of microstructure on resistivity and reliability in copper interconnects
- Lynne M. Gignac
- C.-K. Hu
- et al.
- 2007
- AMC 2007
Electromigration reliability of advanced interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- International Workshop on Stress-Induced Phenomena in Metallization 2007
Lower resistance scaled metal contacts to silicide for advanced CMOS
- A. Topol
- C. Sheraw
- et al.
- 2006
- VLSI Technology 2006
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
Tin incorporated in copper films during damascene copper electrodeposition
- S. Kitayaporn
- Qiang Huang
- et al.
- 2014
- JES
Electrochemical palladium deposition for reducing critical dimensions in nanostructures
- Asli Sahin
- Qiang Huang
- et al.
- 2014
- JES
Impurities in the electroplated sub-50 nm cu lines: The effects of the plating additives
- Qiang Huang
- A. Avekians
- et al.
- 2014
- JES
Electroplating of Fe-rich NiFe alloys in sub-50 nm lines
- D. Liang
- J. Liu
- et al.
- 2014
- JES
An electrochemical method of suppressor screening for Cu plating in sub-100 nm lines
- Qiang Huang
- J. Liu
- et al.
- 2014
- JES