Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement
- Katie Lutker-Lee
- Jennifer Church
- et al.
- 2022
- Journal of Vacuum Science and Technology B
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In-depth feasibility study of extreme ultraviolet damascene extension: Patterning, dielectric etch, and metallization
- Xinghua Sun
- Yann Mignot
- et al.
- 2022
- Journal of Vacuum Science and Technology B
Exploring the stochastics cliff: Understanding the impact of LER/LWR to stochastic defectivity and yield
- Jennifer Church
- Graham Jensen
- et al.
- 2021
- SPIE Photomask Technology + EUV Lithography 2021
A holistic characterization methodology for stochastic printing failures in EUV contact holes
- Jennifer Church
- Brad Austin
- et al.
- 2021
- ASMC 2021
Contact local CD uniformity optimization through etch shrink
- Eric Miller
- Junling Sun
- et al.
- 2021
- SPIE Advanced Lithography 2021
EUV single exposure via patterning at aggressive pitch
- Jing Guo
- Jennifer Church
- et al.
- 2021
- SPIE Advanced Lithography 2021
Nanosheet Metrology Opportunities for Technology Readiness
- Mary Breton
- Daniel Schmidt
- et al.
- 2021
- SPIE Advanced Lithography 2021
Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch
- Jennifer Church
- Luciana Meli
- et al.
- 2020
- J. Micro/Nanolithogr. MEMS MOEMS
Fundamental characterization of stochastic variation for improved single-expose EUV patterning at aggressive pitch
- Jennifer Church
- Luciana Meli
- et al.
- 2020
- SPIE Advanced Lithography 2020
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020