A holistic characterization methodology for stochastic printing failures in EUV contact holes

Abstract

A characterization approach has been developed for evaluating stochastic printing failures in EUV contact holes. Demand for consistent yield exceeding 10 billion contacts requires robust process co-optimization with a focus on stochastic defect reduction throughout the patterning process flow. To monitor and quantify failure rates across process points, implementation of a holistic approach for accurate and high-throughput methodologies is proposed.