Scaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
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19 results for Hirokazu Noma
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate
- Kazushige Toriyama
- Yasushi Takeoka
- et al.
- 2012
- ICSJ 2012
Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- Naoko Unami
- Hirokazu Noma
- et al.
- 2011
- APM 2011
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMPACT 2011
High-bandwidth density and low-power optical MCM using waveguide-integrated organic substrate
- Masao Tokunari
- Hsiang-Han Hsu
- et al.
- 2014
- Journal of Lightwave Technology