Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

15 results for Sri M. Sri-Jayantha

Novel mass reflow method for organic substrates
- - Vijay D. Khanna
  - Sri M. Sri-Jayantha
- 2015
- ECTC 2015
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- - Minhua Lu
  - Steven L. Wright
  - et al.
- 2012
- ECTC 2012
Methodology for predicting C4 non-wets during the chip attach process
- - Vijay D. Khanna
  - Sri M. Sri-Jayantha
- 2010
- ECTC 2010
System-on-Package (SOP) technology, characterization and applications
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2006
- ECTC 2006
TrueTrack™ servo technology for high track density storage
- - S. Sri-Jayantha
  - Hien Dang
  - et al.
- 2000
- APMRC 2000
Heat sink induced thermomechanical joint strain in QFN devices
- - Gerard McVicker
  - Vijay Khanna
  - et al.
- 2014
- Journal of Microelectronics and Electronic Packaging
Preface: IEEE Transactions on Magnetics
- - Sri Sri-Jayantha
  - No Yeol Park
- 2005
- IEEE Transactions on Magnetics
The Role of Static Charge in Ultra-Low Alpha Particle Emissivity Measurements
- - Michael. S. Gordon
  - Kenneth P. Rodbell
  - et al.
- 2015
- IEEE TNS
Impact of organic substrate warp on C4 non-wets
- - Vijay D. Khanna
  - Sri M. Sri-Jayantha
- 2011
- IEEE Transactions on CPMT
Organic substrates for flip-chip design: A thermo-mechanical model that accounts for heterogeneity and anisotropy
- - L. Valdevit
  - V.D. Khanna
  - et al.
- 2008
- Microelectronics Reliability