Thermomechanical modeling of 3D electronic packages
- Sri M. Sri-Jayantha
- Gerard McVicker
- et al.
- 2008
- IBM J. Res. Dev
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15 results for Sri M. Sri-Jayantha
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Multirate controller for dual actuated servomechanism in hard disk drive
- A. Al-Mamun
- T. Suthasun
- et al.
- 2007
- Control and Intelligent Systems
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
TrueTrack™ servo technology for high TPI disk drives
- Sri M. Sri-Jayantha
- Hien Dang
- et al.
- 2001
- IEEE Transactions on Magnetics