Electrodeposited Cu film morphology on thin PVD Cu seed layers
- James J. Kelly
- X. Lin
- et al.
- 2013
- ECS Transactions
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28 results for Patrick W. Dehaven
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- James J. Kelly
- Takeshi Nogami
- et al.
- 2011
- ECS Meeting 2011
Mn-dopant segregation as an indicator of barrier integrity in 32nm groundrule Cu/ultra-low K interconnects
- Andrew H. Simon
- Frieder H. Baumann
- et al.
- 2011
- ADMETA 2011
Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner
- M. Tagami
- C.-C. Yang
- et al.
- 2011
- IITC/MAM 2011
FDSOI radiation dosimeters
- Jeng-Bang Yau
- Michael S. Gordon
- et al.
- 2011
- VLSI-TSA 2011
Comparative study of CVD TiN vs. ALD TiN for contact metallization in 32nm node and beyond
- Valli Arunachalam
- Filippos Papadatos
- et al.
- 2010
- ADMETA 2010
CVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Effect of TaN stoichiometry on barrier oxidation and defect density in 32nm Cu/ultra-low K interconnects
- Andrew H. Simon
- Frieder Baumann
- et al.
- 2010
- MRS Online Proceedings Library
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- Takeshi Nogami
- Chih-Chao Yang
- et al.
- 2008
- ADMETA 2008
Electrical and materials characterization of reactive and co-sputtered tantalum carbide metal electrodes for high-K gate applications
- L.F. Edge
- T. Vo
- et al.
- 2009
- ECS Meeting 2009