Extendibility study of PVD Cu seedlayers in 90nm-groundrule lines and vias
- A. Simon
- S.B. Law
- et al.
- 2004
- AMC 2004
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28 results for Patrick W. Dehaven
Low-temperature melt processing of organic-inorganic hybrid films
- David B. Mitzi
- David R. Medeiros
- et al.
- 2002
- Chemistry of Materials
Crystallographic texture and phase metrology during damascene copper processing
- K.J. Kozaczek
- P. DeHaven
- et al.
- 2002
- MRS Proceedings 2002
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001
In-situ study of Ti/TiN stability under nitrogen anneal
- P. DeHaven
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
Metallization by plating for high-performance multichip modules
- K.K.H. Wong
- S. Kaja
- et al.
- 1998
- IBM J. Res. Dev
Film crystallographic texture and substrate surface roughness in layered aluminum metallization
- K.P. Rodbell
- V. Svilan
- et al.
- 1996
- MRS Spring Meeting 1996
Blanket and local crystallographic texture determination in layered Al metallization
- K.P. Rodbell
- J.L. Hurd
- et al.
- 1995
- MRS Fall Meeting 1995