Implementation of robust nickel alloy salicide process for high-performance 65nm SOI CMOS manufacturing
- Jay Strane
- David Brown
- et al.
- 2007
- VLSI-TSA 2007
Publications
Date
Featured collections
Popular topics
28 results for Patrick W. Dehaven
Extendibility study of PVD Cu seedlayers in 90nm-groundrule lines and vias
- A. Simon
- S.B. Law
- et al.
- 2004
- AMC 2004
Crystallographic texture and phase metrology during damascene copper processing
- K.J. Kozaczek
- P. DeHaven
- et al.
- 2002
- MRS Proceedings 2002
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- J. Kelly
- Takeshi Nogami
- et al.
- 2012
- JES
Low-temperature melt processing of organic-inorganic hybrid films
- David B. Mitzi
- David R. Medeiros
- et al.
- 2002
- Chemistry of Materials
Metallization by plating for high-performance multichip modules
- K.K.H. Wong
- S. Kaja
- et al.
- 1998
- IBM J. Res. Dev