Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
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47 results for Leathen Shi
High-performance 0.07-μm CMOS with 9.5-ps gate delay and 150 GHz fT
- Clement Wann
- Fariborz Assaderaghi
- et al.
- 1997
- IEEE Electron Device Letters
Single charge and confinement effects in nano-crystal memories
- Sandip Tiwari
- Farhan Rana
- et al.
- 1996
- Applied Physics Letters
Finite-element stress analysis of failure mechanisms in a multilevel metallization structure
- L.T. Shi
- K.N. Tu
- 1995
- Journal of Applied Physics
Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Encapsulation of flex inner lead bonds for enhanced reliability
- L.T. Shi
- C. Feger
- et al.
- 1995
- INTERpack 1995
Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure
- L.T. Shi
- K.N. Tu
- 1994
- Applied Physics Letters
Crystallization of amorphous CoSi2 thin films I. kinetics of nucleation and growth
- J.M. Liang
- L.J. Chen
- et al.
- 1994
- Materials Chemistry and Physics
Thickness effect on the crystallization kinetics of electrolessly-deposited Ni(P) thin films
- L.T. Shi
- E.J.M. O'Sullivan
- 1993
- MRS Fall Meeting 1993
Bending of flex leads during thermal cycling
- L.T. Shi
- Ho-Ming Tong
- 1993
- MRS Fall Meeting 1993