Encapsulation of flex inner lead bonds for enhanced reliability
- L.T. Shi
- C. Feger
- et al.
- 1995
- INTERpack 1995
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47 results for Leathen Shi
Wafer-level 3D integration technology
- Steven J. Koester
- Albert M. Young
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional integrated circuits
- Anna W. Topol
- Douglas C. La Tulipe Jr.
- et al.
- 2006
- IBM J. Res. Dev
Hybrid-orientation technology (HOT): Opportunities and challenges
- Min Yang
- Victor W.C. Chan
- et al.
- 2006
- IEEE Transactions on Electron Devices
High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding
- D. Singh
- L.T. Shi
- et al.
- 2003
- Journal of Electronic Materials
A 23.8-GHz SOI CMOS tuned amplifier
- Brian A. Floyd
- Leathen Shi
- et al.
- 2002
- IEEE T-MTT
A 26.5 GHz Silicon MOSFET 2:1 Dynamic Frequency Divider
- Matt Wetzel
- Leathen Shi
- et al.
- 2000
- IEEE Microwave and Guided Wave Letters
Single charge and confinement effects in nano-crystal memories
- Sandip Tiwari
- Farhan Rana
- et al.
- 1996
- Applied Physics Letters
Finite-element stress analysis of failure mechanisms in a multilevel metallization structure
- L.T. Shi
- K.N. Tu
- 1995
- Journal of Applied Physics
Crystallization of amorphous CoSi2 thin films I. kinetics of nucleation and growth
- J.M. Liang
- L.J. Chen
- et al.
- 1994
- Materials Chemistry and Physics