Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
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56 results for Katsuyuki Sakuma
Vacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Solder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- MRS Fall Meeting 2008
Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- K. Sakuma
- N. Nagai
- et al.
- 2009
- ECTC 2009
3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007