Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

54 results for Katsuyuki Sakuma

Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- - Katsuyuki Sakuma
  - Edmund Blackshear
  - et al.
- 2013
- ECTC 2013
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
Solder/adhesive bonding using simple planarization technique for 3D integration
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- - Katsuyuki Sakuma
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- MRS Fall Meeting 2008
Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- - K. Sakuma
  - N. Nagai
  - et al.
- 2009
- ECTC 2009
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
3D chip stacking technology with low-volume lead-free interconnections
- - K. Sakuma
  - P. Andry
  - et al.
- 2007
- ECTC 2007