High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2016
- SPIE Advanced Lithography 2016
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72 results for Sidney Tsai
Resistivity of copper interconnects beyond the 7 nm node
- Adam Pyzyna
- Robert L. Bruce
- et al.
- 2015
- VLSI Technology 2015
Directed self-assembly of topcoat-free, integration-friendly high-χ block copolymers
- Eri Hirahara
- Margareta Paunescu
- et al.
- 2015
- SPIE Advanced Lithography 2015
Fin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015
Customization and design of directed self-assembly using hybrid prepatterns
- Joy Y. Cheng
- Gregory S. Doerk
- et al.
- 2015
- SPIE Advanced Lithography 2015
Self-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2015
- SPIE Advanced Lithography 2015
Computational lithography platform for 193i-guided directed self-assembly
- Kafai Lai
- Melih Ozlem
- et al.
- 2014
- SPIE Advanced Lithography 2014
Towards electrical testable soi devices using directed self-assembly for fin formation
- Chi Chun Liu
- Cristina Estrada-Raygoza
- et al.
- 2014
- SPIE Advanced Lithography 2014
Pattern transfer of directed self-assembly (DSA) patterns for CMOS device applications
- Hsin-Yu Tsai
- Hiroyuki Miyazoe
- et al.
- 2013
- SPIE Advanced Lithography 2013
Directed self-assembly process implementation in a 300mm pilot line environment
- Chi-Chun Liu
- I. Cristina Estrada-Raygoza
- et al.
- 2013
- SPIE Advanced Lithography 2013