Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
- Prabudhya Roy Chowdhury
- Sathya Raghavan
- et al.
- 2023
- ECTC 2023
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15 results for Mukta Farooq
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
- Aakrati Jain
- Risa Miyazawa
- et al.
- 2023
- ECTC 2023
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Vertical channel devices enabled by through silicon via (TSV) technologies
- C. Kothandaraman
- Sami Rosenblatt
- et al.
- 2016
- IEDM 2016
3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2023
- iTHERM 2023
Thermal solution for Co-Packaged Optics (CPO) modules
- Keiji Matsumoto
- Mukta Farooq
- et al.
- 2022
- EDAPS 2022