Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
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15 results for Mukta Farooq
Spatial and temporal thermal characterization of stacked multicore architectures
- Eren Kursun
- Jamil Wakil
- et al.
- 2012
- ACM JETC
3D copper TSV integration, testing and reliability
- Mukta Farooq
- T. Graves-Abe
- et al.
- 2011
- IEDM 2011
3D integration review
- Mukta G. Farooq
- Subramanian S. Iyer
- 2011
- Science China Information Sciences
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006