Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability
- Mukta Farooq
- Giuseppe La Rosa
- et al.
- 2015
- IRPS 2015
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15 results for Mukta Farooq
Copper through silicon via (TSV) for 3D integration
- C. Kothandaraman
- B. Himmel
- et al.
- 2012
- IRPS 2012
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Spatial and temporal thermal characterization of stacked multicore architectures
- Eren Kursun
- Jamil Wakil
- et al.
- 2012
- ACM JETC
3D integration review
- Mukta G. Farooq
- Subramanian S. Iyer
- 2011
- Science China Information Sciences