A six-mask TFT-LCD process using copper-gate metallurgy
- P.M. Fryer
- E.G. Colgan
- et al.
- 1997
- Journal of the Society for Information Display
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67 results for Evan Colgan
Kinetics of suicide formation measured by in situ ramped resistance measurements
- E.G. Colgan
- F.M. D'Heurle
- 1996
- Journal of Applied Physics
Electromigration drift velocity in Al-alloy and Cu-alloy lines
- C.-K. Hu
- K.Y. Lee
- et al.
- 1996
- JES
Nickel suicide thermal stability on polycrystalline and single crystalline silicon
- E.G. Colgan
- J.P. Gambino
- et al.
- 1996
- Materials Chemistry and Physics
The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
- E.G. Colgan
- K.P. Rodbell
- 1994
- Journal of Applied Physics
Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
- E.G. Colgan
- K.P. Rodbell
- et al.
- 1994
- Journal of Applied Physics
Activation energy for C94 and C54 TiSi2 formation measured during rapid thermal annealing
- E.G. Colgan
- L. Clevenger
- et al.
- 1994
- Applied Physics Letters