Publications

68 results for Evan Colgan

Electromigration drift velocity in Al-alloy and Cu-alloy lines
- - C.-K. Hu
  - K.Y. Lee
  - et al.
- 1996
- JES
Nickel suicide thermal stability on polycrystalline and single crystalline silicon
- - E.G. Colgan
  - J.P. Gambino
  - et al.
- 1996
- Materials Chemistry and Physics
Kinetics of Al grain growth, Al₂Cu precipitation, and dissolution in blanket thin films and fine lines
- - E.G. Colgan
  - K.P. Rodbell
  - et al.
- 1994
- Journal of Applied Physics
The role of Cu distribution and Al₂Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
- - E.G. Colgan
  - K.P. Rodbell
- 1994
- Journal of Applied Physics
Manufacturability versus reliability issues relevant to interconnect metallizations
- - K.P. Rodbell
  - E.G. Colgan
  - et al.
- 1994
- MRS Spring Meeting 1994
Activation energy for C94 and C54 TiSi₂ formation measured during rapid thermal annealing
- - E.G. Colgan
  - L. Clevenger
  - et al.
- 1994
- Applied Physics Letters
Rapid evaluations of thin film interfacial reactions using temperature-ramped measurements
- - J.M.E. Harper
  - L. Clevenger
  - et al.
- 1993
- MRS Fall Meeting 1993
Effect of annealing on the Cu distribution and Al₂Cu precipitation in Al(Cu) thin films
- - E.G. Colgan
  - K.P. Rodbell
  - et al.
- 1993
- MRS Proceedings 1993