Publications

68 results for Evan Colgan

Fully Encapsulated Fine Pitch Dual Damascene Organic RDL with Low Dk Df Photosensitive Polyimide and Its Reliability
- - Minhua Lu
  - Joyce Liu
  - et al.
- 2025
- ECTC 2025
Co-Design of 300 mm Wafer Scale Package
- - Kai Schleupen
  - Evan Colgan
  - et al.
- 2024
- ITherm 2024
Thermal Design & Performance of 300 mm Wafer Scale System
- - Evan G. Colgan
  - Phillip Mann
  - et al.
- 2024
- ITherm 2024
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- - Minhua Lu
  - Evan Colgan
- 2024
- ECTC 2024
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- - Evan G. Colgan
  - Kai Schleupen
  - et al.
- 2023
- IEEE Transactions on CPMT
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- - Qianwen Chen
  - Li-Wen Hung
  - et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- - John Knickerbocker
  - Russell A. Budd
  - et al.
- 2018
- ECTC 2018
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- - Pritish R. Parida
  - Arvind Sridhar
  - et al.
- 2017
- SEMI-THERM 2017
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
- - Chao Wang
  - Sung Wook Nam
  - et al.
- 2017
- Nature Communications
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- - Bing Dang
  - Evan Colgan
  - et al.
- 2016
- ECTC 2016