Activation energy for C94 and C54 TiSi2 formation measured during rapid thermal annealing
- E.G. Colgan
- L. Clevenger
- et al.
- 1994
- Applied Physics Letters
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162 results for Cyril Cabral
Comparison of high vacuum and ultra-high-vacuum tantalum diffusion barrier performance against copper penetration
- L. Clevenger
- N.A. Bojarczuk
- et al.
- 1993
- Journal of Applied Physics
Rapid evaluations of thin film interfacial reactions using temperature-ramped measurements
- J.M.E. Harper
- L. Clevenger
- et al.
- 1993
- MRS Fall Meeting 1993
Silicide formation in Ti-Si and Co-Si reactions
- L. Clevenger
- Q.Z. Hong
- et al.
- 1993
- MRS Proceedings 1993
Electrical Resistance and Stress of Bilayer Co(P)/Cu and Ni(P)/Cu Thin Films
- M. Paunovic
- L. Clevenger
- et al.
- 1993
- JES
Role of Stress Relief in the Hexagonai=Close=Packed to Face-Centered-Cubic Phase Transformation in Cobalt Thin Films
- D.A. Smith
- K. Barmak
- et al.
- 1993
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Octagonal Washer De Squids and Integrated Susceptometers Fabricated in a Planarized Sub-^Im Nb - A10X - Nb Technology
- M.B. Ketchen
- D.J. Pearson
- et al.
- 1993
- IEEE TAS
The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films
- L. Clevenger
- A. Mutscheller
- et al.
- 1992
- Journal of Applied Physics
Kinetic analysis of C49-TiSi2 and C54-TiSi2 formation at rapid thermal annealing rates
- L. Clevenger
- J.M.E. Harper
- et al.
- 1992
- Journal of Applied Physics
Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
- Karen Holloway
- Peter M. Fryer
- et al.
- 1992
- Journal of Applied Physics