Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
Publications
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55 results for Paul Andry
High-dielectric constant insulators and the AMLCD process: is amorphous BST a candidate?
- P. Andry
- D.A. Neumayer
- et al.
- 1999
- MRS Spring Meeting 1999
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
Atomic-beam alignment of inorganic materials for liquid-crystal displays
- P. Chaudhari
- James Lacey
- et al.
- 2001
- Nature
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Circuits 2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Technology 2015
Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
- K.N. Chen
- Cyril Cabral Jr.
- et al.
- 2010
- VLSI-TSA 2010