3-D silicon integration and silicon packaging technology using silicon through-vias
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2006
- IEEE Journal of Solid-State Circuits
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55 results for Paul Andry
Driving large-sized OLED TVs with an amorphous-silicon backplane
- Takatoshi Tsujimura
- Frank Libsch
- et al.
- 2005
- Journal of the Society for Information Display
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
Floating-island TFT leakage caused by process step reduction
- Takatoshi Tsujimura
- Osamu Tokuhiro
- et al.
- 2002
- IEEE Transactions on Electron Devices
Dry vertical alignment method for multi-domain homeotropic thin-film-transistor liquid crystal displays
- C. Cai
- Alan Lien
- et al.
- 2001
- Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers