The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015
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16 results for Thomas Wassick
Comparison of electromigration behaviors of SnAg and SnCu solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- IRPS 2009
Excimer laser ablation of polyimide: A 14-year IBM perspective
- James H. Brannon
- Thomas A. Wassick
- 1997
- SPIE Photonics West 1997
Chip Power-Frequency Scaling in 10/7nm Node
- Phil Oldiges
- Reinaldo A. Vega
- et al.
- 2020
- IEEE Access
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Creep characterization of solder bumps using nanoindentation
- Yingjie Du
- Xiao Hu Liu
- et al.
- 2016
- Mechanics of Time-Dependent Materials