The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
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21 results for Charles Goldsmith
Effect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
Blech effect in Pb-free flip chip solder joint
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Applied Physics Letters
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2008
- Applied Physics Letters
Thermal stress evolution in embedded Cu/low-k dielectric composite features
- Conal E. Murray
- Charles C. Goldsmith
- et al.
- 2006
- Applied Physics Letters
Spatially transient stress effects in thin films by X-ray diffraction
- C.E. Murray
- C.C. Goldsmith
- et al.
- 2005
- Powder Diffraction
Finite size effects in stress analysis of interconnect structures
- I.C. Noyan
- Conal E. Murray
- et al.
- 2004
- Applied Physics Letters
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing