Compression for data archiving and backup revisited
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
Lawrence Suchow, Norman R. Stemple
JES
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Kenneth R. Carter, Robert D. Miller, et al.
Macromolecules