Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
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26 results for Derren Dunn
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- T. Dalton
- N. Fuller
- et al.
- 2004
- IITC 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- T. Dalton
- A. Cowley
- et al.
- 2003
- ADMETA 2003
Bayesian dropout approximation in deep learning neural networks: Analysis of self-Aligned quadruple patterning
- Scott D. Halle
- Derren N. Dunn
- et al.
- 2022
- JM3
Texture transformations in reactive metal films deposited upon amorphous substrates
- D. Dunn
- R. Hull
- et al.
- 2001
- Journal of Applied Physics