A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
Publications
Date
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26 results for Derren Dunn
Nanoporous materials integration into advanced microprocessors
- E. Todd Ryan
- Cathy Labelle
- et al.
- 2005
- MRS Spring Meeting 2005
Speeding up OPC by leveraging existing designs with machine learning
- Cheng Chi
- Julian Dolby
- et al.
- 2021
- SPIE Advanced Lithography 2021
Bayesian dropout approximation in deep learning neural networks: Analysis of self-aligned quadruple patterning
- Scott D. Halle
- Max O. Bloomfield
- et al.
- 2020
- SPIE Advanced Lithography 2020
EUVL mask process development and verification using advanced modeling and characterization techniques
- Michael Green
- Romain Lallement
- et al.
- 2020
- SPIE Advanced Lithography 2020
EUV mask challenges and requirements for ultimate single exposure interconnects
- Chris Progler
- Michael Green
- et al.
- 2019
- SPIE Advanced Lithography 2019
Design intent optimization at the beyond 7nm node: The intersection of DTCO and EUVL stochastic mitigation techniques
- Michael Crouse
- L. Liebmann
- et al.
- 2017
- SPIE Advanced Lithography 2017
Guiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond
- Derren Dunn
- John R. Sporre
- et al.
- 2017
- SPIE Advanced Lithography 2017
EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Etch correction and OPC, a look at the current state and future of etch correction
- Ian Stobert
- Derren Dunn
- 2013
- SPIE Advanced Lithography 2013