Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

41 results for Philip L. Flaitz

Reflow of copper on ruthenium
- - C.-C. Yang
  - Y. Loquet
  - et al.
- 2011
- ADMETA 2011
Co capping layers for Cu/low-k interconnects
- - C.-C. Yang
  - P. Flaitz
  - et al.
- 2010
- ADMETA 2010
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Endurance improvement of Ge₂Sb₂Te₅-based phase change memory
- - Chieh-Fang Chen
  - A.G. Schrott
  - et al.
- 2009
- IMW 2009
Ionized-PVD stacked barrier structure of TaN/TaRu for 32nm BEOL integration
- - Takeshi Nogami
  - Chih-Chao Yang
  - et al.
- 2008
- ADMETA 2008
Copper contact metallization using Ru-based barrier liners for 45 nm and 32 nm nodes: Reliability and device performance
- - Soon-Cheon Seo
  - Chih-Chao Yang
  - et al.
- 2008
- ADMETA 2008
Cr migration on 193nm binary photomasks
- - John Bruley
  - Geoffrey Burr
  - et al.
- 2009
- SPIE Advanced Lithography 2009
A multilevel copper/low-k/airgap BEOL technology
- - S.V. Nitta
  - S. Ponoth
  - et al.
- 2007
- ADMETA 2007
Electromigration reliability of advanced interconnects
- - C.-K. Hu
  - L. Gignac
  - et al.
- 2007
- International Workshop on Stress-Induced Phenomena in Metallization 2007