Implementation of robust nickel alloy salicide process for high-performance 65nm SOI CMOS manufacturing
- Jay Strane
- David Brown
- et al.
- 2007
- VLSI-TSA 2007
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116 results for Conal Murray
Theory for electromigration failure in Cu conductors
- J.R. Lloyd
- C.E. Murray
- et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Thin-film transistors based on spin-coated chalcogenide semiconductor channels
- David B. Mitzi
- Matthew Copel
- et al.
- 2004
- TFTT 2004
High mobility solution-deposited chalcogenide films for flexible applications
- David B. Mitzi
- Delia J. Milliron
- et al.
- 2005
- VLSI Technology 2005
Integration of direct plating of Cu onto a CVD Ru liner
- S. Malhotra
- D. Canaperi
- et al.
- 2004
- AMC 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- R. Filippi
- J.F. McGrath
- et al.
- 2004
- IRPS 2004
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
Probing strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- MRS Proceedings 2003
Texture evolution in Al(Cu) interconnect materials
- C.E. Murray
- K.P. Rodbell
- 2001
- MRS Proceedings 2001