Corrosion in low dielectric constant Si-O based thin films: Buffer concentration effects
- F.W. Zeng
- Stephen M. Gates
- et al.
- 2014
- AIP Advances
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38 results for M.W. Lane
Corrosion of Si-O based porous low-k dielectrics
- A.B. Hall
- G.J. Irvine
- et al.
- 2012
- Applied Physics Letters
Effects of silylation on fracture and mechanical properties of mesoporous silica films interfaced with copper
- D.D. Gandhi
- B. Singh
- et al.
- 2009
- Journal of Applied Physics
Pore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters
Optimized interfacial strength for dense and porous SiCOH
- D.D. Restaino
- Steve Molis
- et al.
- 2007
- ADMETA 2007
Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
- A. Grill
- D. Edelstein
- et al.
- 2008
- Journal of Applied Physics
Chip package interaction in ultra low-k/copper interconnect technology
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- ICEPT 2007
Chip-package-interaction modeling of ultra low-k/copper back end of line
- X.-H. Liu
- T.M. Shaw
- et al.
- 2007
- IITC 2007
Experimental determination of the toughness of crack stop structures
- T.M. Shaw
- E. Liniger
- et al.
- 2007
- IITC 2007
Annealing-induced interfacial toughening using a molecular nanolayer
- Darshan D. Gandhi
- Michael Lane
- et al.
- 2007
- Nature