Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
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24 results for Li Jun Jiang
Time-domain field responses of the thin, high-contrast, finely layered structure in IC packagings
- Adrianus T. De Hoop
- Lijun Jiang
- 2010
- EPEPS 2010
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009
Interconnect performance and scaling strategy for the 22 nm node and beyond
- James H.-C. Chen
- Lijun Jiang
- et al.
- 2008
- ADMETA 2008
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008
Electromagnetic simulation for inhomogeneous interconnect and packaging structures
- Lijun Jiang
- Barry J. Rubin
- et al.
- 2007
- IEEE Topical Meeting EPEPS 2007
Integral equation solvers for real world applications -Some challenge problems
- W.C. Chew
- I.T. Chiang
- et al.
- 2006
- APS 2006